Roadmap / Future Plans

While Wlink has a bunch of infrastructure in place already, we have just begun to see what it possible. Listed here are several items we plan to or are currently developing.

• TileLink Applicaiton Layer

• AMBA ATB Application Layer

• Ability to expose Wlink Link Layer Interfaces to the top of Wlink

  • Would allow users to create their own Flow Control blocks

• sbt test setup for large regressions of various Wlink designs

• Integration into Chipyard for rapid SoC development

• PHY Wrapper that would support a subset of PIPE

• Extending Wlink Nodes for NoC development

• Topology-aware link layer components

• Packet coat-tailing for increased bandwidth